Parker Lord is hosting a free virtual training event featuring its Chemlok® rubber-to-substrate adhesives on December 6 at 11 AM (EST). Parker Lord Senior Scientist Jeff Means and Application Engineer Cristina DiFranco will provide the technical training. This virtual training will consist of two, one-hour pre-recorded training sessions followed by a live question-and-answer session with each presenter. The first training session will focus on proper substrate preparation, adhesive preparation and application techniques, coated part handling, and molding best practices. The second training session will focus on troubleshooting bond failures and preventative actions.
RDAbbott is hosting a free training webinar titled, “Chemlok® Application and Troubleshooting,” that will feature rubber-to-substrate adhesives from Parker LORD. In this live webinar, Parker LORD Senior Scientist Jeff Means and Application Engineer Cristina DiFranco will focus on proper substrate preparation, adhesive application, and molding best practices. The training will also include a prerecorded workshop for troubleshooting bond failures.
RDAbbott is hosting a free training webinar titled, “Chemlok® Application and Troubleshooting,” that will feature rubber-to-substrate adhesives from Parker LORD. In this live webinar, Parker LORD Senior Scientist Jeff Means and Application Engineer Cristina DiFranco, will focus on proper substrate preparation, adhesive application, and molding best practices. They will also facilitate an interactive workshop, using webinar polls, for troubleshooting bond failures.
RDAbbott is hosting a free training webinar titled, “Chemlok® Application and Troubleshooting,” that will feature rubber-to-substrate adhesives from Parker LORD. In this live webinar, Parker LORD Senior Scientist Jeff Means and Application Engineer Cristina DiFranco, will focus on proper substrate preparation, adhesive application, and molding best practices. They will also facilitate an interactive workshop, using webinar polls, for troubleshooting bond failures.